HB16 is a manual/ semiautomatic thermosonic wire bonder for Wedge Bonding, Ball bonding and Ball Bumping.
Ultrasonic system: 62 kHz transducer, PLL Control - Utrasonic power: 0 - 2 W output - Bond time: 15 - 5000 ms - Bond force: 15 - 100 g - Gold and Aluminium wire: 17 to 76 μ (0,7 to 3 mil) - Gold ribbon: up to 25 x 250 µ (1 x 10 mil) - Wire feed angle: 90° for wire and ribbon - Motorized Y travel: stepback up to 6 mm (240 mil) Option - Motorized Z travel: 15 mm - Throat depht: 165 mm (6,7”) - Fine Table motion: 10 mm (0,55”) - Mouse ratio: 6:1 - Temperature controller: up to 250°C ± 1°C
