Open Positions

Hybrid 3D Printing

Dragonfly IV
Chilab ITEM Laboratory
A multi-material, multi-layer 3D printer that generates entire circuits in one step including substrate, conductive traces and passive components.
Deposition Technology: Piezo drop-on-demand inkjet - Build Volume: 160mm x 160mm x 3mm - Inks: Optimized silver nano particles and dielectric inks - Min. Dielectric Layer Thickness: 10.0 μm - Min. Conductive Layer Thickness: 1.18 μm - Supported File Formats: All major ECAD and MCAD Software, ODB++, Gerber & Excellon, STLs - Dielectric Constant (Dk): @ 2 GHz/15 GHz 2.77 / 2.78 - Tangential Loss (Df): @ 2 GHz/15 GHz 0.015 / 0.018 - Resolution: 18 µm (x), 18 µm (y), 10 µm (z) - Min. Line/Space: 75 μm traces/ 100 μm spacing - Min. BGA Pitch: 350 μm - Min. Via: 150 µm
We firmly believe that one of the Group’s strengths lies in the transdisciplinary approach that stems from active collaboration between experts from different fields, crucial for achieving results in both research and technological transfer.
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