The FINEPLACER® lambda 2 is a die bonder with sub-micron placement accuracy for fine pitch devices, such as: flip chips and flip chip assemblies, optoelectronic components, micro electro mechanic systems (MEMS), micro optoelectronic mechanic systems (MOEMS), sensors, micro optics, TAB, bare chips and high-count surface mounted devices (SMD).
The FINEPLACER® system is based on a unique placement principle. Using the highly accurate Vision Alignment System (VAS), the FINEPLACER® lambda 2 accurately places the component on the first attempt. With its accuracy of 0.5 μm, it is possible to position new technology components with very fine pitch uniformly and accurately.
Accuracy: 0.5 μm - Component: Min: 0.03 mm x 0.03 mm; Max: 20 mm x 20 mm - Substrate: 150 mm x 150 mm - Force: from 0.1 N to 400 N
