The Disco DAD 3221 is a dicing machine, capable of cutting wafers and samples as thick as 2mm. It can handle silicon, glass, sapphire and most other hard materials. Its motorised stage X-Y control allows very precise positioning of the blade over pre-existing structures; a fine control over Z allows complete or partial cut into the specimen. An automatic pattern recognition routine also allows automatic dicing of large wafers with arbitrary markers.
Up to 6” wafers - Various blade widths, depending of specimen material and application, from 50 to 250 microns - Dicing speed up to 10 mm/s - Full automation and programmable positioning of cut lines
