A versatile wafer bonding system capable of handling substrate sizes ranging from small pieces up to 200 mm.
Max contact force: 10, 20, 60 kN - Single chips processing - Manual loading chamber - Vacuum :Standard: 0.1 mbar - Many thermoplastics can be used for hot embossing, such as PMMA, PC, PE, COC, COP, PS, PVDF, … - High aspect ratios with lateral resolution down to 0,1 µm can be obtained - Highly precise moulding of any structures in polymers, especially microstructures with aggressive aspect ratio (up to 150:1)
