Reflow Oven

Mechatronika MR10
Chilab ITEM Laboratory, CL1000
It is a fully programmable far infra red oven, suitable for reflow soldering as well as glue heat drying.
Welding area: 170x270mm - Board dimensions: 200x300mm - Preheating temperatures: up to approximately 250°C - Soldering temperature: up to approximately 430°C - Welding cycle: approximately 4 minutes
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