Open Positions

Wafer Bonder

AWB04 AML
PiQuET Laboratory
The AML-AWB aligner wafer bonder platform can perform in-situ aligned bonding using the following bonding methods: anodic, glass frit, adhesive, thermo-compression, eutectic, solder and direct (low T “RAD” activated).
4 and 6 inches tungsten upper and lower platens for all bondings except anodic - 4 and 6 inches graphite upper platens for anodic bonding - Water wapor RAD system for surface activation prior to direct bonding - In-situ alignement (both visible and IR cameras available) - Pressure control system (to insert a process gas of choice, up to 2 bar) available
We firmly believe that one of the Group’s strengths lies in the transdisciplinary approach that stems from active collaboration between experts from different fields, crucial for achieving results in both research and technological transfer.
RESEARCH ACTIVITIES