Accurate thermal modelling is crucial for ensuring the reliability and longevity of Power Modules (PM), particularly in demanding applications like electric vehicles and renewable energy systems. Traditional single-source Cauer network models, while computationally efficient, often fail to capture the complex thermal interactions within modern PM, which feature multiple heat sources and intricate packaging structures. This thesis aims to address this limitation by extending the Cauer network approach to incorporate multiple heat sources, representing individual semiconductor devices within the module, and by considering the thermal coupling between them [1][2][3].
The work will be organised as follow:
- Literature review on thermal modelling
- Develop a simplified model
- Prepare a simple MATLAB interface to get user-personalised results
- Test the results with FEM tools
- Igic, P. M., et al., Thermal model of power semiconductor devices for electro-thermal circuit simulations
- Nagy, L., et al., 3D self-heating electro-thermal model of multi-die IC
- Zhou, Z., et al., Compact thermal model of a three-phase IGBT inverter power module
For more information please contact luciano.scaltrito@polito.it , valentina.bertana@polito.it
