Direct Bonded Copper (DBC) is a high-performance substrate for power modules. It consists of multiple copper layers directly bonded to a ceramic substrate. This design offers excellent thermal and electrical conductivity and high mechanical strength, making it ideal for high-power applications. [1] However, due to CTE mismatch of the different layers, warpage may occur, causing a inhomogeneous contact with the heatsink and generating hot spots following a positive feedback loop. [2] The thesis goal is to understand the fundamentals of the warpage formation in power module and to produce/adapt an algorithm that allows to measure, using FEM analysis, the mutual relationship between different substrate design parameters.
The work will be organized as follow:
• Literature review of Power Module.
• Sketch of a basic FEM analysis.
• Algorithm development.
• FEM analysis integration within the developed algorithm.
• Results comparison with existing Literature or available samples.
[1] Neeb, Innovative and Reliable Power Modules: A Future Trend and Evolution of Technologies, in IEEE Industrial Electronics Magazine, 2014
[2] Xu, An optimal structural design to improve the reliability of Al2O3–DBC substrates under thermal cycling, 2016
For more information, please contact valentina.bertana@polito.it, sergio.ferrero@polito.it, luciano.scaltrito@polito.it
