This thesis proposal investigates the integration of heat pipes into high-power ceramic substrates to enhance thermal management in demanding electronic applications. As power densities in electronic devices continue to rise, effective heat dissipation becomes critical for ensuring device reliability and performance. Ceramic substrates, known for their high thermal conductivity and electrical insulation, are increasingly used in high-power applications. However, their thermal performance can be further improved by integrating heat pipes, which offer superior heat transfer capabilities. This research will explore novel methods for embedding miniature heat pipes within ceramic substrates, focusing on material compatibility, interface design, and fabrication techniques.
The aim is to develop a robust and scalable integration process that significantly improves the thermal management capabilities of high-power ceramic substrates. This work builds upon existing research demonstrating the benefits of heat pipes in electronic cooling and the advancements in ceramic substrate manufacturing. The findings will contribute to the development of advanced thermal solutions for high-power electronic devices, enabling higher power densities and improved reliability [1, 2].
The work will be organised as follow:
