Laser microwelding is a useful technique for processing copper, aluminum, nickel, gold, silver and platinum strips with widths up to 2 mm and thicknesses up to 0.5 mm. This Back-End process is particularly suitable for bonding wires and tapes to pressure-sensitive substrates, such as battery contacts. The candidate will study, develop the laser microwelding process and characterize the strength of the joint.
For more information, please contact luciano.scaltrito@polito.it
