Accurate thermal modelling is crucial for ensuring the reliability and longevity of Power Modules (PM), particularly in demanding applications like electric vehicles and renewable energy systems. Traditional single-source Cauer network models, while computationally efficient, often fail to capture the complex thermal interactions within modern PM, which feature multiple heat sources and intricate packaging structures. This […]
This thesis proposal outlines a research plan focused on the development and characterization of lead-free alloy micro-bumps for flip-chip technology, utilizing sputtering deposition. Sputtering, a vacuum deposition technique, offers precise control over alloy composition and microstructure, crucial for achieving reliable and robust micro-bumps. This research will investigate the deposition of promising lead-free alloys, such as […]
This thesis proposal investigates the integration of heat pipes into high-power ceramic substrates to enhance thermal management in demanding electronic applications. As power densities in electronic devices continue to rise, effective heat dissipation becomes critical for ensuring device reliability and performance. Ceramic substrates, known for their high thermal conductivity and electrical insulation, are increasingly used […]
The thesis work will focus on the use of different laser sources to modify the surface of certain materials typically used in packaging. The work will be organized as follows: Research on the state of the art Procurement of relevant materials Definition of the tests to be conducted Laser processing tests on the materials Characterization […]
The thesis work will focus on the use of polymers integrated with ceramic particles for the fabrication of devices for electromagnetic applications. The work will be organized as follows: • Research on the state of the art • Definition of an appropriate fabrication process based on the final application • Definition of the tests to […]
Porosity is a common defect which occurs in solder joints. Porosity in surface mount joints will potentially cause weakening in joint strength and reduction in electrical and thermal conductivity. It will induce crack initiation and shorten the fatigue life of solder joints. In fact, pores contained in solder joints may intensify the stress and decrease […]
The work will be organized as follow: review of the state of the art Optimization of an existing device development of a prototype For more information, please contact valentina.bertana@polito.it, sergio.ferrero@polito.it, luciano.scaltrito@polito.it
Piezoelectric materials are widely used in electronics as both sensors and actuators [1, 2]. When operating in their linear regime, these materials can accurately measure force by monitoring the voltage generated across their terminals [3]. However, crystals with a polar axis exhibit both pyroelectric and piezoelectric properties, meaning they generate polarization in response to both […]
Electronic Integration is now considered a new paradigm for the semiconductor packaging industry to sustain Moore’s law. Vertical stacking of semiconductor chips provides high power density in a given footprint area. However, owing to increased integration, 3-D ICs having multiple core areas (hotspots) on each stack layer can often be prone to thermal interaction between […]
Direct Bonded Copper (DBC) is a high-performance substrate for power modules. It consists of multiple copper layers directly bonded to a ceramic substrate. This design offers excellent thermal and electrical conductivity and high mechanical strength, making it ideal for high-power applications. [1] However, due to CTE mismatch of the different layers, warpage may occur, causing […]
Laser microwelding is a useful technique for processing copper, aluminum, nickel, gold, silver and platinum strips with widths up to 2 mm and thicknesses up to 0.5 mm. This Back-End process is particularly suitable for bonding wires and tapes to pressure-sensitive substrates, such as battery contacts. The candidate will study, develop the laser microwelding process […]
The development of processes and materials for interconnection technologies at the board, module and package level and the integration of electrical, optical and power electronic components and systems are at the forefront of our research. The candidate will develop the design of System in Package devices using finite element modeling. For more information, please contact […]
Besides die attach soldering and Al heavy wire bonding, new packaging concepts are pursued to built power electronics systems which shall provide improved thermal performance and higher reliability. By replacing the wire bond with an area contact on both sides of the chips the thermal performance can be improved. The candidate will develop the design […]
The key factor of power devices is efficiency, the ability to move energy from the source to the load with minimal dispersion. In an ideal world, a power device that operates with forward bias allows current to flow without any resistance, making the device operate with zero power dissipation. In the real world any semiconductor […]
The thesis is dedicated to the study of MEMS electrical contacts to test "chip level" power components (Si, SiC, GaN). The candidate will have to analyze the test conditions of the main power components and study a manufacturing process for cantilever-based cartridges. For more information, please contact luciano.scaltrito@polito.it
Development of functionalized nanostructured electrodes for application in an electrochemical cell capable of absorbing CO2 and recovering electrical energy through the process known as "capacitive mixing". For more information, please contact andrea.lamberti@polito.it
Development of a new technology for direct solar energy conversion and storage in a single device. For more information, please contact andrea.lamberti@polito.it
For more information, please contact andrea.lamberti@polito.it
Fabrication of graphene-based membranes for energy and mineral recovery from waste aqueous solutions. For more information, please contact andrea.lamberti@polito.it
For more information, please contact andrea.lamberti@polito.it
For more information, please contact andrea.lamberti@polito.it
For more information, please contact andrea.lamberti@polito.it
For more information, please contact andrea.lamberti@polito.it
For more information, please contact andrea.lamberti@polito.it
For more information, please contact andrea.lamberti@polito.it
Study of graphene-based nanostructured electrodes for the fabrication of flexible energy storage devices. For more information, please contact andrea.lamberti@polito.it
In this thesis work, it will be required to optimize the process parameters for 3D printing of metastructures capable of exhibiting programmable behavior in the THz spectrum for the development of advanced sensors and detectors For more information, please contact ignazio.roppolo@polito.it
For more information, please contact francesca.frascella@polito.it, lucia.napione@polito.it
For more information please contact francesca.frascella@polito.it, lucia.napione@polito.it
For more information, please contact francesca.frascella@polito.it, lucia.napione@polito.it
Numerous medical technologies are being devised that use physical stimuli (electrical, mechanical, optical, magnetic). However, this research is still in its embryonal form, and experimental information are lacking. In addition to the necessary experimental data to be produced, a lot can be done by exploiting existing resources, in particular in the form of published omics. […]
In collaboration with INRIM. For more information, please contact francesca.frascella@polito.it, a.angelini@inrim.it
For more information, please contact simone.marasso@polito.it, francesca.frascella@polito.it, lucia.napione@polito.it
For more information, please contact simone.marasso@polito.it, pasquale.dangelo@imem.cnr.it, giuseppe.tarabella@imem.cnr.it
