SMIP - Sistemi Microelettronici In Package

2024-2027
The main aim of the project is to address the new technological challenges arising from SiP innovation, all while considering a supply chain perspective. Thus, the project aims, through a case study structure, to study devices based on SiP technology. All necessary processes that are relevant to the design, development and validation phases of both devices and components - along the entire supply chain - will be examined. Adding to this, the project strives to introduce, where possible, materials that improve the overall ecological footprint of the devices.
FRAMEWORK
Bando SWich - F.E.S.R. 2021-2027
PARTNERS
UniTo, UniPO, Spea SpA, Asseltech Srl, Cemas Elettra Srl, Mista SpA

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We firmly believe that one of the Group’s strengths lies in the transdisciplinary approach that stems from active collaboration between experts from different fields, crucial for achieving results in both research and technological transfer.
RESEARCH ACTIVITIES